É豸Ãû³Æ Equipment Name

°åʽ͸Ã÷µ¼µç±¡Ä¤³Á»ýÉ豸(RPD/PAR/PVD)  Inline TCO Coating Equipment (Reactive Plasma Deposition, RPD/PAR),and Magnetron Sputter,PVD

É豸ÐͺŠEquipment Model

PAR5500A

É豸ÓÃ; Equipment Application

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In-line physical coating equipment for Transparent Conductive Oxide (TCO) coating on wafer,glass plate or flexible substrate.

¶ÆĤԭÀí Coating Principle

1¡¢´Å¿Ø½¦Éä³Á»ý¡£

Magnetron Sputter (PVD).

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Reactive Plasma Deposition (RPD).

¼¼ÊõÌØµã  Features

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Multiple cathode operation for seed layer and multiple refractive index tandem TCO.

2¡¢RPD¾ßÓÐÎÞ¸ßÄÜÀë×Óºä»÷³Äµ×Ìصã£¬ÄÜÖƱ¸¸ßÉÙ×ÓǨÒÆÂʵÄTCO¡£
No bombardment on the substrate while keeping high mobility.

É豸²ÎÊý  Parameters